Industry News: clm9000 l plus (Page 3 of 4)

ADLINK Employs Latest Intel® Atom™ and Intel® Celeron® SoC for High Performance, Low Power Designs From SMARC Modules to Rugged Systems

Industry News | 2014-03-20 10:03:43.0

ADLINK Technology announced an array of new products in various form factors based on the latest Intel® Atom™ and Celeron® processors for intelligent systems, featuring a significant performance per watt improvement over previous generations, high integration of both low speed and high speed IO’s, an advanced graphics engine, and virtualization support - all on a sub-10-watt system-on-chip (SoC) that enables small, light, and reliable embedded designs.

ADLINK Technology, Inc.

PerkinElmer Announces Financial Results for the Third Quarter of 2007

Industry News | 2007-10-26 12:58:57.0

WALTHAM, Mass.-Oct. 25, 2007-PerkinElmer, Inc. (NYSE: PKI), a global leader in Health Sciences and Photonics markets, today reported financial results for the third quarter and nine months ended September 30, 2007. For the third quarter 2007, the Company reported GAAP earnings per share from continuing operations of $0.26.

PerkinElmer Optoelectronics

PerkinElmer Announces Financial Results for the Fourth Quarter of 2007

Industry News | 2008-01-28 21:37:36.0

WALTHAM, Mass.--Jan. 24, 2008--PerkinElmer, Inc. (NYSE: PKI), a global leader in Health Sciences and Photonics markets, today reported financial results for the fourth quarter and fiscal year ended December 30, 2007. For the fourth quarter 2007, the Company reported GAAP earnings per share from continuing operations of $0.46.

PerkinElmer Optoelectronics

Mentor Graphics Announces New HyperLynx Technology with Advanced 3D Channel and Trace Modeling, Superior Accuracy and Fastest Simulation Performance

Industry News | 2013-02-01 15:00:00.0

Mentor Graphics announced the newest release of its market-leading HyperLynx® product for superior high-speed design and analysis. Key features in the new HyperLynx product release include advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance—up to 5X faster.

Mentor Graphics

ADLINK Introduces COM Express® Basic Size Type 6 Module with AMD Embedded R-Series APU for High Definition Graphics

Industry News | 2015-03-31 20:43:39.0

ADLINK Technology introduced the Express-BE, a COM Express™ Basic Size Type 6 computer-on-module based on the 2nd generation AMD Embedded R-Series APU (Accelerated Processing Unit, which combines the CPU & GPU on a single System-on-Chip, or SOC) with A77E FCH, delivering power efficiency and high definition visuals to high-performance medical imaging applications.

ADLINK Technology, Inc.

ADLINK Launches Compact, Military Grade HPERC-IBR-H Series Rugged Systems for Mission & Payload Computing

Industry News | 2015-04-23 14:29:07.0

ADLINK Technology today announced release of the compact, Extreme Rugged™ HPERC-IBR-H Series military grade system in a sealed, IP67-rated enclosure featuring high speed MIL-DTL-38999 connectors. At just 63.5/100mm (2.5/3.9 inch) x 150/178mm (5.9/7 inch) x 203mm (8.0 inch), the HPERC-IBR-H Series is a highly integrated, compact VITA 75 compliant unit almost 30% smaller than other leading competitive products.

ADLINK Technology, Inc.

Koh Young America is Eager to Highlight New Inspection Developments at SMTA International on 3-4 November 2021

Industry News | 2021-09-26 16:58:37.0

Atlanta, GA – During the past year, the Koh Young development efforts continued unabated, and Koh Young America is eager to highlight a selection of its latest developments to the reliability experts, process engineers, executives, project managers, designers, and technologists attending SMTA International to help shape the future of the electronics assembly industry. The event will be held November 1-4, 2021 at the Minneapolis Convention Center in Minneapolis, Minnesota and is co-located with Medical Design & Manufacturing (MD&M) to bring together one of the largest audiences of engineering and manufacturing professionals in the Midwest.

Koh Young America, Inc.

Koh Young America is Eager to Highlight New Inspection Developments at SMTA International on 3-4 November 2021

Industry News | 2021-09-30 15:14:09.0

During the past year, the Koh Young development efforts continued unabated, and Koh Young America is eager to highlight a selection of its latest developments to the reliability experts, process engineers, executives, project managers, designers, and technologists attending SMTA International to help shape the future of the electronics assembly industry. The event will be held November 1-4, 2021 at the Minneapolis Convention Center in Minneapolis, Minnesota and is co-located with Medical Design & Manufacturing (MD&M) to bring together one of the largest audiences of engineering and manufacturing professionals in the Midwest.

Koh Young America, Inc.

ADLINK Launches cPCI-6940 6U CompactPCI® Processor Blade with Intel® Xeon® Processor D-1500 and AMD Radeon™ E8860 Embedded GPU

Industry News | 2016-09-29 23:16:55.0

ADLINK Technology introduces the cPCI-6940 processor blade featuring the Intel® Xeon® processor D-1500 and AMD Radeon™ E8860 embedded GPU. The cPCI-6940 6U CompactPCI processor blade offers up to 16-core computing power and high-performance graphics in a robust design. With an extended operating temperature range of -45°C to 85°C and 16GB of DDR4 soldered memory, the cPCI-6940 is ideal for the rugged environments encountered by military field vehicles and naval or aerospace carriers.

ADLINK Technology, Inc.

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