Industry News | 2013-10-01 04:27:08.0
Fuji Machine Manufacturing Co., Ltd. is proud to announce the release of the DynaHead (HX) and HexaFeeder for our electronic component mounting machines (placing machines). DynaHeads are supported on AIMEX II and AIMEX IIS machines. HexaFeeders are supported on NXT II, NXT III machines as well as AIMEX-series machines.
Industry News | 2022-04-28 14:12:06.0
The new YRM20, a premium high-efficiency, high speed modular mounter from Yamaha Motor Intelligent Machinery (IM), features an exceptionally High-Speed Rotary (RM) head) that achieves up to 115,000 Components Per Hour (CPH). It boosts high speed mount capability for the complete range of typical SMT devices, without the need to select several placement heads to cover the range of components being placed.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2013-11-12 16:12:53.0
Juki Automation Systems announces that it was awarded a 2013 Global Technology Award in the category of “Placement – Medium to High Volume” for its RX-6 Flex Placer. T
Industry News | 2014-03-12 11:24:53.0
HITACHI's Sigma G5S modular mounter's Multi-function head now features lead clinching and tamping functionalities. Its lead clinching capability uses side-mounted lighting and machine vision to identify and precisely locate through-hole component leads. During placement/insertion, clinching simultaneously takes place to prevent the inserted component from falling out or becoming dislodged prior to soldering.
Industry News | 2014-12-17 19:57:30.0
Fuji's Scalable Placement Platform NXT III now supports 0201 mm (0.25 x 0.125 mm, 008004") components as standard. By loading the newly developed H24G head on the NXT III, 0201 mm (0.25 x 0.125 mm, 008004") components can be supported without any change to the specifications of the machine (speed: 35,000 cph, accuracy: ±25 μm). The Intelligent Part Sensor (IPS), which checks the orientation of parts on the nozzle and ensures that the part does not remain on the nozzle after placement, is standard on the H24G placement head.
Industry News | 2013-01-12 12:27:34.0
With its new SIPLACE Very-High-Force Head for odd-shaped components, ASM Assembly Systems is adding another major option for its SIPLACE SX placement machines. The new Very-High-Force Head is able to place components up to 30 millimeters high and 200 millimeters long with a force of up to 70 newtons. That way, users can process on their SMT line even extremely large components with snap-in or through-the-hole fasteners such as connector modules for automotive or IT applications.
Industry News | 2021-12-05 22:58:45.0
Two component epoxy resin meter mix dispense for transformers
Industry News | 2008-11-12 18:12:27.0
TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-5000 tabletop ultrasonic stencil and misprint cleaner, which is part of its SAWA platform of products. The system comes complete with cleaning head, generator, foot pedal, large 32 x 32 tray and 30 foam pads.
Industry News | 2013-12-09 23:37:23.0
Fuji exhibited its newest units at Productronica 2013 that was held from November 12th to the 15th in Germany. Thanks goes to all who came to Fuji's booth. The number of customers that visited the booth this year greatly exceeded that of the previous show.
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