Industry News | 2012-07-18 10:12:06.0
ViTrox Technologies,introduces the G2 Series of its V510 Advanced Optical Inspection (AOI) solution. The V510 G2 Series offers powerful technologies and high-throughput productivity for SMT line production.
Industry News | 2009-06-23 20:26:31.0
Debuting its most recent technology advance, mass imaging leader DEK will showcase the company’s new thin wafer processing expertise from booth #811 at the upcoming Semicon West event in San Francisco, California. A full line solution that incorporates a Galaxy Thin Wafer System and a next-generation CHAD WaferMate™ wafer handler, this latest development resolves traditional challenges associated with high-speed handling and processing of thinned wafers on a proven print platform.
Industry News | 2017-08-03 06:15:05.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.
Industry News | 2016-09-21 15:33:30.0
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2018-02-01 20:18:01.0
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.
Industry News | 2014-07-30 12:10:12.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # A-1H30 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
Industry News | 2015-01-28 15:15:27.0
Gen3 Systems will showcase MEK’s (Marantz Business Electronics) SpectorBOX “Bottom-Up” 3D Modular AOI system at Southern Manufacturing & Electronics, FIVE, Farnborough February 10-12, 2015. The system replaces traditional board flipping alternatives in less space and at a lower cost.
Industry News | 2004-07-19 11:24:45.0
Parvus unveils benchtop development station for use with PC/104, PC/104-Plus, ISA and PCI computer boards
Industry News | 2010-05-20 14:37:59.0
DENVER — Krayden, Inc., a leading silicone supplier that specializes in technical knowledge and support for high tech-based applications, now offers Dow Corning Solar Solutions’ PV-804 Neutral Sealant. The diverse substrate adhesion qualities, consistent performance and reliability against environmental degradation, have made this sealant a proven solution within the photovoltaic industry.
