Industry News: cold slump (Page 1 of 2)

Indium Corporation to Feature New Solder Paste for Fine Feature Printing at APEX 2018

Industry News | 2017-12-19 19:54:07.0

Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.

Indium Corporation

FCT Assembly Debuts NC676 No-Clean Leaded Solder Paste

Industry News | 2010-10-26 22:46:06.0

FCT Assembly introduces the new NC676 no-clean leaded solder paste, featuring its latest technology in print and reflow in the no-clean category.

FCT ASSEMBLY, INC.

Nihon Superior to Highlight Advanced Soldering Materials at SMTAI 2010

Industry News | 2010-10-04 17:16:14.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it will highlight its SN100C P602 Solder Paste and NS-F900 Wave Soldering Flux in booth 226 at the upcoming SMTA International exhibition, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Nihon Superior Co., Ltd.

Nihon Superior’s SN100C P602 Wins Prestigious Global Technology Award

Industry News | 2010-10-27 19:08:56.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it has been awarded a Global Technology Award in the category of Environmentally Friendly Products/Services for its SN100C P602 Solder Paste.

Nihon Superior Co., Ltd.

FCT Assembly Wins Solder Paste Evaluation Conducted by Major OEM

Industry News | 2013-05-01 11:03:43.0

FCT Assembly today announced that it won a major OEM in the Northwest with its NL932 lead-free no-clean solder paste. The OEM evaluated six solder paste suppliers.

FCT ASSEMBLY, INC.

FCT Assembly to Display Advanced Solder Pastes and Stencil Technology at SMTAI 2009

Industry News | 2009-09-17 15:08:48.0

GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

FCT ASSEMBLY, INC.

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011

Industry News | 2011-09-21 12:22:09.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Nihon Superior Co., Ltd.

Kester Introduces EnviroMarkTM 919G Lead-Free Solder Paste Halogen-Free and No-Clean at Productronica 2007

Industry News | 2007-11-01 20:33:22.0

ITASCA, IL � November 1, 2007 � Kester announces it will launch the new EnviroMark 919G (EM919G) lead-free solder paste in Hall A4, Stand 363 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

Lloyd Doyle

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