Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2013-10-09 08:35:53.0
SEHO Systems GmbH will exhibit in Hall A4, Stand #578 at the Productronica International Trade Fair in Munich, Germany.
Industry News | 2015-04-07 15:34:16.0
Microtronic GmbH, a leading sales specialist of microelectronics, will display a range of products in Booth # 7-101L at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2009-01-30 19:36:20.0
DENVER � January 2009 � Krayden, Inc., a leading distributor of engineered materials, announces that the Dow Corning Americas Electronics Channel Team named Krayden, Inc. as the recipient of the Distributor of the Year Award and GOLD level status for 2008.
Industry News | 2011-09-28 19:53:50.0
AIM announces that Karl Seelig, Vice President of Technology, will present a paper titled “Overcoming the Challenges of QFNs” at the upcoming SMTA International Conference & Exhibition.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2013-04-08 13:46:37.0
Kyzen Corporation announces that Debbie Carboni will present “Removal of Flux Residues from Highly Dense Assemblies” at IMAPS NE 40th Symposium & Expo on Tuesday, May 7, 2013 at the Holiday Inn Conference Center in Boxborough, MA.
Industry News | 2022-04-06 12:02:37.0
Seika Machinery, Inc. is pleased to offer a wide range of Sawa ultrasonic cleaners. From portable, manual stencil cleaners to fully automatic systems like the Sawa Ecobrid cleaner that can clean and dry in just six minutes, there is a solution for any cleaning application including removal of particulates from nozzles, squeegees, pallets, misprints and other parts.
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