Industry News | 2010-04-10 02:07:54.0
IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
Industry News | 2020-02-18 14:13:29.0
Michael Ford, Dale Lee, Joe O’Neil and S. Manian Ramkumar honored for their on-going leadership in IPC and the electronics industry
Industry News | 2011-09-19 13:31:20.0
STI Electronics introduces its new Micro-Coil Spring Array as an improved alternative to standard rigid arrays.
Industry News | 2011-11-20 12:48:27.0
STI Electronics has been awarded a Global Technology Award in the category of Components for its Micro-Coil Spring Array.
Industry News | 2021-04-01 08:18:33.0
TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Industry News | 2020-11-17 11:26:03.0
TopLine Corporation will exhibit in the 58th annual IEEE Nuclear and Space Radiation Effects Conference (NSREC), which will have its first Virtual Conference and Exhibition beginning November 29 and accessible through December 30. Live virtual Exhibits will be accessible December 1-8.
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2001-03-13 08:46:35.0
The Exhibition Hall of IMAPS 2001, The 34th International Symposium on Microelectronics, is 80% sold out, according to John Graves, General Chair of the symposium. "We are well ahead of our goal for this time, and have even outstripped our progress for last year" he stated. "We're excited, because it's going to be a terrific show and symposium, with more than 350 exhibitor booths and a cutting-edge technical conference." IMAPS 2001 takes place this coming October 9 - 11, 2001 at the Baltimore Convention Center, Baltimore, MD USA.
International Microelectronics Assembly and Packaging Society (IMAPS)
