Industry News | 2022-06-02 06:58:59.0
IPC releases PCB industry results for April 2022
Industry News | 2022-07-25 08:38:11.0
IPC Releases EMS Industry Results for June 2022
Industry News | 2022-09-26 06:57:25.0
IPC releases PCB industry results for August 2022
Industry News | 2022-11-29 07:14:30.0
IPC Releases PCB Industry Results for October 2022
Industry News | 2023-01-30 16:41:18.0
IPC releases PCB industry results for December 2022
Industry News | 2024-03-26 13:57:30.0
IPC releases PCB industry results for February 2024
Industry News | 2001-12-27 10:09:51.0
IPC today announced the U.S. Printed Wiring Board Industry Book-to-Bill Ratio for November 2001 was 0.87. Sales billed (shipments) in November 2001 decreased 53.2% from November 2000 and orders booked decreased 57.1% from November 2000. Compared to 2000, bookings of PWBs are down 50.2% year-to-date, while shipments of PWBs are down 30.8% year-to-date.
Industry News | 2010-02-18 21:26:02.0
Minneapolis, MN - The SMTA is pleased to announce several new webinars coming up in March. Webinars are 60 to 90 minute online presentations comparable to a conference session. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Industry News | 2011-01-28 17:42:56.0
The SMTA is pleased to announce several new online presentations coming up this Spring. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
