Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2015-10-06 19:39:34.0
JUKI released a space-saving compact PWB Inspection Machine "RV-2" at home and abroad in March 18. As a single-lane inspection machine, "RV-2" inherits the high-accuracy inspection capability of the high-end PWB Inspection Machine RV-1. This is an in-line type high-precision PWB inspection machine in space saving compact design.
Industry News | 2010-06-10 09:05:34.0
Virtual component tables enable product changeovers with no downtown
Industry News | 2014-06-12 18:15:30.0
Transition Automation today unveils a new paste retainers design which improves the management of solder paste within the printing area. The new product "SPR" helps eliminate leakage of solder paste out of the print area by way of a floating spring supported paste retainer attached to the end of the squeegee holder.
Industry News | 2008-10-07 11:11:04.0
Accurate to 0.05% of full scale, the original 1988 instrument design was very well executed. However vintage 1980's state of the art electronic components were going end-of-life at an alarming rate.
Industry News | 2010-03-27 20:23:48.0
With its technical innovations, its gantries that can be exchanged within minutes and the SIPLACE Multistar CPP placement head with its very large component spectrum, the SIPLACE SX placement platform sets new standards in electronics production. Beyond these more technical aspects, the capacity-on-demand concept of the SX Series uses "Rent-a-Gantry" to open the door to groundbreaking new business models, which are becoming increasingly important for electronics manufacturers in today’s business environment.
Industry News | 2010-05-04 08:04:45.0
After the highly successful introduction of its SIPLACE SX1 and SX2 placement machines featuring swappable gantries (“Capacity-on-Demand”), Siemens Electronics Assembly Systems will unveil the new SIPLACE SX4 at the SMT/Hybrid/Packaging trade show in Nuremberg, Germany (June 6-8, 2010; Hall 7, Booth 204).
