Industry News | 2016-05-02 19:28:57.0
Count On Tools is offering special introductory pricing on all MYDATA Feeder Repair Kits, effective immediately through July 31, 2016.
Industry News | 2016-05-09 21:01:24.0
Count On Tools introduces the new MYDATA Agilis Feeder Repair Set. This option allows customers to convert any Agilis feeder to any of the four sizes to reduce overall feeder count and maximize production capabilities.
Industry News | 2016-09-01 19:49:29.0
Count On Tools today announced that it has extended the special introductory pricing on all MYDATA Feeder Repair Kits through the remainder of the year. The special pricing began in May and will be effective through December 31, 2016.
Industry News | 2017-07-06 09:41:29.0
Count On Tools today announced plans to expand its repair program for Mycronic Agilis Feeders by offering Feeder Repair Kits for the Agilis FLEX feeders. Each Mycronic Feeder Repair Kit will include: a precision machined aluminum side cover plate and matching barcode.
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2011-04-09 13:57:46.0
Count On Tools Inc. now provides Fuji NXT Nozzle Repair and Rework Services. This service is available for all standard nozzles for the H01, H04 and H08/H12 heads.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
