Industry News: component vs toolbit (Page 1 of 8)

EMC Automotive Component Testing Detailed in Free Wall Chart from Schaffner EMC

Industry News | 2003-06-25 12:28:40.0

The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.

SMTnet

Experts to Discuss Bottom Termination Components during the IPC & SMTA High-Reliability Cleaning & Conformal Coating Conference

Industry News | 2014-10-28 19:14:24.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter Tutorial – Supporting High Reliability at the OEM: A PCB Perspective

Industry News | 2019-04-30 17:39:40.0

The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.

Surface Mount Technology Association (SMTA)

Lead-free Reflow Profile: Soaking type vs. Slumping type

Industry News | 2018-10-18 08:44:36.0

Lead-free Reflow Profile: Soaking type vs. Slumping type

Flason Electronic Co.,limited

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Panel Discussion on Cleaning Process Integration

Industry News | 2008-10-20 20:33:29.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Steve Stach, President of Austin American Technology, will moderate a collaborative panel discussion on process integration. The panelists will comprise OEM and EMS process engineers who have experience and expertise in implementing cleaning processes. The panelists include Dave Adams of Rockwell Collins, Jerry Purnell of Philips Medical, Jeff Kennedy of Celestica, Jim Raby of STI Electronics, Dale Lee of Plexus, and Linda Woody of Lockheed Martin. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Association Connecting Electronics Industries (IPC)

SMTA and MEPTEC Issue Medical Electronics Symposium Call for Presentations

Industry News | 2010-04-30 18:37:58.0

Minneapolis, MN - The SMTA and MEPTEC are pleased to announce the Call for Presentations for the 2010 Medical Electronics Symposium. The two-day technical program titled "Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward" will be held September 22-23, 2010 at Arizona State University in Tempe, AZ. ASU's School of Biological and Health Systems Engineering will co-sponsor this event.

Surface Mount Technology Association (SMTA)

Medical Electronics Symposium Registration Open

Industry News | 2010-07-29 15:48:21.0

SMTA and MEPTEC announce registration for the two-day symposium titled "Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward" is now open. The event will be held September 22-23, 2010 at Arizona State University in Tempe, AZ. ASU's School of Biological and Health Systems Engineering is co-sponsoring the event.

Surface Mount Technology Association (SMTA)

SMTA and MEPTEC Issue Medical Electronics Symposium Call for Presentations

Industry News | 2011-03-28 14:09:31.0

The SMTA and MEPTEC are pleased to announce the Call for Presentations for the 2011 Medical Electronics Symposium. The two-day technical program will be held September 27-28, 2011 at Arizona State University in Tempe, AZ. ASU's School of Biological and Health Systems Engineering will co-sponsor this event.

Surface Mount Technology Association (SMTA)

Count On Tools Introduces Ceramic Nozzles for UIC’s Placement Equipment

Industry News | 2011-01-28 17:29:19.0

Count On Tools Inc. introduces new Ceramic Nozzle Series for the complete line of Universal Instruments Corporation’s (UIC) pick-and-place machines, including Genesis, Advantis, Flexjet and GSM.

Count On Tools, Inc.

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

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