Industry News | 2023-04-03 13:24:06.0
IPC welcomes the action of U.S. President Joe Biden today in issuing a "presidential determination" that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).
Industry News | 2023-10-09 09:12:51.0
Smt Xtra is pleased to announce plans to exhibit in Booth #1426 the upcoming SMTA International 2023 event. This prestigious exhibition is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention Center in Minnesota. The event will provide a platform for SMT Xtra USA Inc. to showcase its latest innovations in SMT Machine Feeders, Nozzles, Replacement Machine Parts, and Consumable items.
Industry News | 2020-12-01 17:14:52.0
Heralds Design-through-Manufacturing 4.0
Industry News | 2017-12-18 18:12:33.0
ITW EAE, the Electronic Assembly Equipment division of Illinois Tool Works, announces a new partnership agreement with Murray Percival Company to represent and distribute Vitronics Soltec soldering equipment beginning January 1, 2018 for the territory of Michigan, Indiana, Ohio and Kentucky. This agreement is an expansion of Murray Percival Company’s representation of ITW EAE’s product line which already included MPM printers, Camalot dispensers, and Electrovert soldering and cleaning equipment.
Industry News | 2011-11-01 10:40:46.0
AIM has appointed Electronic Assembly Products (EAP) as its representative in Indiana and Kentucky.
Industry News | 2018-07-17 14:02:04.0
Connected, “smart” wearables such as rings, bracelets, clothing and shoes are benefitting from tiny RF chip antennas that take up less PCB space and allow for more miniaturized devices
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2012-01-17 15:25:04.0
LPKFwill be exhibiting in booth #570 at the upcoming MD&M West Conference and Expo, scheduled to take place February 14-16, 2012 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2019-03-12 08:54:28.0
(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.
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