Industry News: conceptronic and driver (Page 4 of 9)

Indium Corporation Announces Automotive Electronics Assembly and Packaging Webinar

Industry News | 2020-08-28 02:49:18.0

Indium Corporation's Andy Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will host an automotive electronics webinar with SEMI at 11 a.m. Eastern Time (4 p.m. British Time/11 p.m. Malaysia Time) on Thursday, Sept. 17.

Indium Corporation

Essemtec’s Technology Day to Highlight Future Dispensing and MID Technologies

Industry News | 2012-11-06 11:22:15.0

Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.

ESSEMTEC AG

AFV-P Series Programmable AC Power Supplies With DC Output and Precision Measurement Capabilities

Industry News | 2018-08-31 12:50:11.0

Versatile programmable AC+DC power sources suit a variety of test situations and power simulations

Saelig Co. Inc.

ADLINK Announces MAPS Suite for Measurement and Automation Modules

Industry News | 2019-09-02 19:53:53.0

ADLINK Technology announces a new generation of all-in-one software solutions: Measurement, Automation, and Platform Suite (MAPS). To improve process efficiency and shorten development time and effort, developers working with DAQ and PXI modules may immediately begin work with MAPS software packages such as ADLINK Connection Explorer (ACE), diagnostic tools, and easy-to-use testing utilities to analyze device functionality in one click. By continuously working with customers and engineers, ADLINK strives to make application development time faster, easier and more productive than ever.

ADLINK Technology, Inc.

Indium Corporation AnnouncesAutomotive Electronics Assembly and Packaging Webinar

Industry News | 2020-10-04 15:34:25.0

Indium Corporation'sAndy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Material Applications, will host an automotive electronics webinar with the Malaysia chapter of the IEEE Electronics Packaging Society (EPS) in observance of IEEE Day 2020at 9:30 a.m.Malaysia Time on Wednesday, Oct. 14 (9:30 p.m. Eastern Time on Oct. 13/2:30 a.m.British Time on Oct. 13).

Indium Corporation

TRUMPF and KDPOF Become Strategic Partners for Automotive Data Communications

Industry News | 2022-09-07 08:41:33.0

Optical interconnects to become an indispensable part in future cars

KDPOF

FIVEberry Establishes Broad and Easy Access to RISC-V Technology

Industry News | 2023-05-25 10:58:22.0

ARIES Embedded Launches a 'Community-Flavor-Board' for Quick Project Entry and Fast Prototyping Based on OSM-compatible MSRZFive SiP with RZ/Five Microprocessor from Renesas

ARIES Embedded GmbH

FIVEberry Establishes Broad and Easy Access to RISC-V Technology

Industry News | 2023-05-30 06:50:32.0

ARIES Embedded Launches a 'Community-Flavor-Board' for Quick Project Entry and Fast Prototyping Based on OSM-compatible MSRZFive SiP with RZ/Five Microprocessor from Renesas

ARIES Embedded GmbH

Tyco Electronics Completes the Sale of its Radio Frequency Components and Subsystem and Automotive Radar Sensors Businesses

Industry News | 2008-10-01 23:45:54.0

PEMBROKE, Bermuda, Sept. 29 /PRNewswire-FirstCall/ Tyco Electronics Ltd. (NYSE: TEL)(BSX: TEL) has completed the previously announced sale of its Radio Frequency Components and Subsystem business, which was formerly part of the company's Wireless Systems segment. The business, which designs and manufactures RF components and subsystems for the aerospace, defense and commercial markets, was sold to Cobham Defense Systems Division, a subsidiary of Cobham plc.

TE Connectivity


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