Industry News | 2020-03-08 16:49:19.0
IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2020-06-11 06:05:22.0
IPC announces the release of a new standard, IPC-9797, Press-fit Standard for Automotive Requirements and Other High-Reliability Applications. The comprehensive document covers the qualifications and acceptance requirements for press fit technology, including the high-reliability needs for automotive and other industries such as aerospace.
Industry News | 2017-10-17 18:53:50.0
A new report published this week by IPC, Trends in the North American Market for PCB Prototypes, reveals cycles in demand for PCB prototypes that often differ from demand trends in regular or volume-production PCB sales. Despite high volatility in prototype sales from month to month, the IPC data show clear cycles in prototype sales growth, year over year. Rigid PCB and flexible circuit prototype sales do not always reflect growth in the rigid PCB and flexible circuit markets overall.
Industry News | 2018-01-04 14:51:18.0
IPC-1401, Supply Chain Social Responsibility Management System Guidance was listed as a top-10 standard in 2017, for Chinese Corporate Social Responsibility (CSR). CHINA WTO TRIBUTE magazine published the Chinese CSR 2017 listing, which focuses on influential events in the Chinese economy and worldwide corporate coverage.
Industry News | 2021-03-04 08:54:01.0
IPC alerted members about the U.S. Environmental Protection Agency's (EPA) final risk management rules to reduce exposure to five persistent, bioaccumulative, and toxic chemicals (PBTs). The alert calls attention to the rules, which went into effect February 5, 2021, and to one of the five PBTs with a history of use in electronics: phenol, isopropylated, phosphate (3:1) (known as PIP (3:1)).
Industry News | 2016-06-19 19:44:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2017-05-11 17:06:16.0
Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.
Industry News | 2022-08-26 08:50:31.0
Economic picture looks worse than a month ago, but no clear determination if we are in a recession
Industry News | 2003-01-27 09:31:04.0
The Conference Will Take Place March 22-27
Industry News | 2003-01-31 16:13:14.0
Will Take Place in Conjunction with IPC SMEMA Council�s APEX� in Anaheim, Calif.
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