Industry News | 2008-10-25 22:05:53.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Harald Wack (Session Chair) of Zestron Corporation, Jason Keeping of Celestica, Barry Richie of Dow Corning Corporation, Phil Kinner of Humiseal, and Lamar Young of Specialty Coating Systems will present in Session 5 on Conformal Coating Adhesion. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2016-09-15 18:27:44.0
Motorized design takes guess-work out of repositioning applicators during printed circuit board assembly and electronics manufacturing.
Industry News | 2018-04-16 20:18:35.0
SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2014-10-16 19:22:45.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL.
Industry News | 2018-07-26 18:53:00.0
Nordson ASYMTEK a Nordson company announces an automated coating inspection (ACI) line combining its Select Coat® SL-940 Conformal Coating system with the FX-940UV Series ACI/AOI Automated Conformal Coat Inspection system. Together, the systems ensure a conformal coating process that's accurate and reliable, and delivers ongoing coating quality and consistency.
Industry News | 2010-10-04 17:26:28.0
Industry-leading associations IPC and SMTA jointly announce the chairs of Workshop 2 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2015-09-16 11:15:59.0
Nordson ASYMTEK introduces the NexJet® NJ-8 System which improves and simplifies the dispensing process for fast-paced production environments where precision, flexibility, and long-term reliability are important. The NJ-8's ReadiSet™ 2-piece jet cartridge is quickly and easily removed, cleaned, inspected, and re-installed without tools, maximizing equipment utilization and up-time. The NexJet system is an integral part of Nordson ASYMTEK's comprehensive closed-loop dispensing systems and fully-integrated software-control of the precision jet dispensing process.
Industry News | 2019-08-21 16:17:24.0
Nordson ASYMTEK introduces its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.
Industry News | 2018-10-25 15:13:49.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
