Industry News | 2012-03-09 17:47:15.0
IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.
Industry News | 2020-02-18 14:50:19.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
Industry News | 2018-10-25 15:13:49.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2012-09-26 14:28:18.0
SMTA and IPC announce the program for the High-Reliability Cleaning and Conformal Coating Conference. The conference will be held November 13-15, 2012 at the Crowne Plaza Hotel-O'Hare in Chicago, Illinois. This event is focused on electronics assembly reliability and the influence of cleaning and coating on the production of reliable hardware.
Industry News | 2016-09-01 19:18:58.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, IL. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2016-10-20 19:46:11.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2017-02-13 13:31:26.0
Nordson ASYMTEK introduces its upgraded EasyCoat® 6 software for its Select Coat® SL-940 conformal coating system. EasyCoat 6 software combines several powerful capabilities to deliver a visual programming experience that reduces programming time, increases throughput and productivity, and achieves high quality conformal coating results. Key features include drag-and-drop graphical overlay programming, online and offline programming, and Applicator Tip Tracking. The new look of the user interface includes updated iconography, new color schemes, and a variety of customizable settings to personalize the programming environment.
Industry News | 2018-06-03 19:35:57.0
Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.
Industry News | 2018-09-27 16:58:07.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, IL. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
