Industry News | 2003-05-12 09:19:51.0
No larger than conventional 12A wire-to-board connectors for PCB applications
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
Industry News | 2018-10-20 11:13:11.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on October 15 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2016-09-29 20:30:17.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on September 26 at IPC's Fall Standards Development Committee Meetings in Rosemont, Ill. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise in the development of electronics manufacturing standards.
Industry News | 2013-02-25 11:24:45.0
Upgrade a CS400E to a 12.1" LCD Touchscreeen. Or upgrade that old 486 PC currently running the 400E.
Industry News | 2006-01-13 09:13:58.0
Do you have issues with the height of your paste deposit when printing close to your clamp foils? Let SigmaPrint take you to the EDGE of your printing boundaries!
Industry News | 2009-12-03 18:24:04.0
DEK has announced the launch of its new Over Top Snuggers (OTS) substrate clamping technology. Securing printed circuit boards firmly in place ready for processing, the flexible technology is designed to ensure high quality printing for enhanced end-of-line yield.
Industry News | 2005-04-28 12:05:17.0
Offer On-Resistance Down to 1.2 Ohms in SC-70 and SOT-23 Packages
Industry News | 2015-09-22 11:52:54.0
PennEngineering® has been awarded U.S. Patent No. 9,113,567 for a unique three-piece heat sink mounting system designed to securely attach heat sinks to printed circuit boards while providing firm and constant contact to the chip component for optimized heat dissipation. The inventor of this dynamic mounting system is Robert F. Stotz, Jr.
Industry News | 2021-04-22 17:10:07.0
New ESD-Protection Diode with Wettable Flanks Features Low Capacitance to 0.37pF typical in the Compact DFN1110-3A Package
