Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2021-05-24 04:37:04.0
HVAC stands for heating, ventilation, and air conditioning. This system provides heating and cooling to residential and commercial buildings. These systems use fresh air from the outdoors to provide high indoor air quality. The V in the HVAC or ventilation is the process or replacing or exchanging air within a space.
Industry News | 2016-06-22 16:15:35.0
KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2018-11-27 11:54:36.0
Digicom Electronics announces that it has upgraded its Medical Quality Device Certification to ISO 13485:2016. The ISO 13485 standard is a series of requirements that help device makers develop a quality management system to ensure the quality, safety, and effectiveness of the medical devices they manufacture. Digicom specializes in complex products and those that require the utmost precision, reliability, durability, and enhanced performance.
Industry News | 2015-11-12 21:24:58.0
KYZEN is pleased to announce that it will present at the LED A.R.T. Symposium, scheduled to take place Nov. 17-19, 2015 at the Crowne Plaza Midtown in Atlanta, GA. Dr. Mike Bixenman will present the paper titled “LED Failure Mechanisms That Can be Linked to Post Assembly Cleaning.”
Industry News | 2016-02-29 09:18:03.0
Inventec introduces new enhanced co-solvent, Topklean EL20P for challenging refluxing applications, To learn more about Topklean EL20P you can visit Inventec at IPC Apex exhibition, booth 1863.
