Industry News: contamination golden pad (Page 1 of 4)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:23:09.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS

Industry News | 2011-08-18 21:24:08.0

For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

Association Connecting Electronics Industries (IPC)

ESD Cleanroom Mouse Pads

Industry News | 2016-01-18 15:45:28.0

Blue Thunder Technologies introduces a new line of cleanroom compatible mouse pads.

Blue Thunder Technologies, Inc.

Innodisk Unveils DDR4 Memory for Industrial Applications on Upcoming Skylake Platform

Industry News | 2015-03-20 05:30:21.0

A Full Range of DDR4 UDIMM and SO-DIMM Modules Available for the Next Generation of Embedded

Innodisk Corporation

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

HVAC

Industry News | 2021-05-24 04:37:04.0

HVAC stands for heating, ventilation, and air conditioning. This system provides heating and cooling to residential and commercial buildings. These systems use fresh air from the outdoors to provide high indoor air quality. The V in the HVAC or ventilation is the process or replacing or exchanging air within a space.

Quick Time Engineering Inc

Toronto Expo

Industry News | 2015-04-28 18:03:55.0

KYZEN is pleased to announce that it will present at the Toronto SMTA Expo & Tech Forum, scheduled to take place Thursday, May 21, 2015 at the Hilton Toronto/Markham Suites Conference Centre in Markham, ON. Dr. Mike Bixenman will present the paper titled “How Clean is Clean Enough?”

KYZEN Corporation

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contamination golden pad searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155