Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2009-08-19 19:55:21.0
EAST WINDSOR, CT — August 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that its GREEN MONSTER formulation has the abrasion resistance to withstand the high friction caused by the wiping action, the integrity to resist fibers from being pulled off by sticky solder paste, and the toughness to withstand the harsh scraping and grating action caused by the stencil’s apertures.
Industry News | 2020-01-15 15:51:08.0
Nordson MARCH, a Nordson company introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H for plasma treatment of catheters at their full extended length. Plasma cleans and activates the surface prior to applying a lubricious coating and provides adhesive bonding of the balloon to the catheter. It removes contamination, impurities, and organics at the nanometer level and improves surface wettability, hydrophilicity, and bonding capabilities to address issues such as poor wetting, poor coating uniformity, voids, and poor adhesion.
Industry News | 2019-05-22 11:33:05.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Industry News | 2019-05-22 11:33:07.0
While no material is entirely lint-free, there are materials that are virtually lint-free. This is an important attribute to look for in your stencil wiping roll. Contaminated PC boards are a common problem. While the contamination itself is often thought of as a mystery to the printer operator, the cause may come from the stencil wiping roll. This is largely due to the sticky solder paste and sharp edges of the stencil’s apertures.
Industry News | 2018-09-13 17:46:51.0
Anda Technologies USA features a line of precision high-performance fluid dispensing and underfill systems. The entry-level SP-1 plasma cleaning machine from Anda is applicable for mobile phone, computer, digital printing and packaging, plastic, glass, automotive, electronic, medical, and surface activation treatment.
Industry News | 2015-07-01 15:44:06.0
Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.
