Industry News | 2007-10-26 13:08:43.0
MORRISVILLE, NC - October 24, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the KE-2060RL High-speed Fine-pitch Assembler with IFS-X2 in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.
Industry News | 2013-01-14 14:43:06.0
Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO
Industry News | 2013-03-20 23:21:03.0
On November 22, 2012, SEICA Italy held a technical seminar dedicated to the electronic testing of PCBs. This meeting was the official opportunity to present to the attending companies the new product line called RAPID; flying probers targeted to PCB testing. The product represents the combined knowledge and expertise of the SEICA BBT line, and is based on the "Ultra Fast” technology. In addition to speed, attention to aesthetics and improved ergonomics were also very important. Compactness and rationality, combined with the software ease of use, are the result of Seica’s research to develop a system that is simple to use and maintain.
Industry News | 2018-01-09 19:04:20.0
Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.
Industry News | 2018-02-08 19:40:28.0
Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.
Industry News | 2018-02-27 13:51:33.0
Following the winning philosophy which characterized its business in testing and assembly over three decades, based on the constant and rapid innovation of its solutions, Seica will attend the Apex 2018 exhibition with many new products. Products will complement some restyling’s of solutions presented in the past, almost completely renewing the portfolio of Seica solutions, enhancing the level of technology applied to testing and assembly of electronic boards and components.
Industry News | 2003-10-21 16:34:24.0
Company's New Product Introduction Development and Prototyping Lab Provides State-of-the-Art Equipment and Facilities to OEMs 24x7
Industry News | 2008-03-04 12:05:25.0
APEX, NC - January 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new iineo-II SMT platform in booth 1624 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, in Las Vegas.
Industry News | 2008-09-14 15:09:42.0
APEX, NC - September 2008 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will showcase its iineo-II SMT platform in booth 423 at the upcoming IPC Midwest Conference & Exhibition that is scheduled to take place September 24�25, 2008 at the Renaissance Schaumburg Hotel & Convention Center.
Industry News | 2009-03-10 19:05:30.0
APEX, NC - January 2009 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO-2 SMT platform in booth 473 at the upcoming APEX 2009 Conference & Exhibition that is scheduled to take place March 31-April 2, 2009 in Las Vegas.
