Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Industry News | 2003-03-11 08:28:59.0
To cooperate in the development of flexible circuit technology incorporating proprietary printing and plating technologies.
Industry News | 2003-02-17 10:48:14.0
Pricewaterhouse Coopers, Inc. was Appointed Trustee in Bankruptcy
Industry News | 2003-05-15 08:37:06.0
Recognition for helping to extensively grow Tyco Electronics' product sales from 2001 to 2002
Industry News | 2003-05-28 08:20:13.0
Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Association Connecting Electronics Industries (IPC)
Industry News | 2001-10-26 17:06:52.0
IPC has signed a three-year Cooperative Research and Development Agreement (CRADA) with the Naval Surface Warfare Center, Crane, Ind.
Industry News | 2021-07-06 15:14:09.0
IPC and Weiss Engineering have signed a cooperative agreement to deliver industry intelligence to the European electronics community, expanding on a partnership that began in 2020.
Industry News | 2010-06-04 16:23:16.0
BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
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