Industry News: coplanarity connector (Page 1 of 2)

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010

Industry News | 2010-05-11 14:43:51.0

Saint-Egrève, France - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.

Vi TECHNOLOGY

Goepel Presents Free Webinar on Quality Control of Plug-in Contacts Using 3D Measurement

Industry News | 2015-10-13 14:07:18.0

Goepel is pleased to announce their latest webinar, "3D Circumference Inspection for Connector Insertion - Quality Control of Plug-in Contacts using 3D Measurement Method" on Tuesday, October 27th.

GOEPEL Electronic

Vi TECHNOLOGY to Display Award-Winning SPI and AOI at SMT Hybrid Packaging

Industry News | 2015-04-07 15:51:51.0

Vi TECHNOLOGY will exhibit in Booth 7A-331 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Vi TECHNOLOGY

Vi TECHNOLOGY®'s component inspection solutions to reduce defective PCBAs @ Nepcon Shenzhen 2010

Industry News | 2010-08-09 13:23:20.0

Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.

Vi TECHNOLOGY

Vi TECHNOLOGY Brings State-of-the-art Inspection to SMTAI

Industry News | 2014-08-28 12:11:35.0

Vi TECHNOLOGY announces that it will exhibit in Booth #319 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Vi TECHNOLOGY

Vi TECHNOLOGY exhibits its full product range of AOI solutions at Nepcon China booth 4F10

Industry News | 2010-04-14 21:28:49.0

Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.

Vi TECHNOLOGY

Drive Down Defects with True3D Technology from Koh Young

Industry News | 2021-03-25 15:57:22.0

Koh Young will present a free smart inspection webinar on Wednesday, 31 March 2021 at 10:00AM CDT (GMT -5). The webinar will focus on how intelligent inspection solutions focused on pin and terminal inspection to increase productivity, improve quality, and reduce costs. Register today to secure your seat in the virtual event and understand how Koh Young solutions can help you to drive down defects in automotive and connector applications. Register today to secure your seat in the virtual event to learn from how to reduce costs and increase yields with Koh Young.

Koh Young America, Inc.

Panasonic Introduces NPM-D3, the Latest in the Award-Winning NPM-Series

Industry News | 2014-09-09 12:33:50.0

– Panasonic Factory Solutions Company of America introduces the NPM-D3 to the award-winning, multi-functional NPM-series SMT platform. In addition to its interchangeable, plug-and-play placement heads, the NPM-D3 integrates solder paste inspection (SPI), adhesive dispense (ADH), and post-placement inspection (AOI).

Panasonic Factory Solutions Company of America (PFSA)

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Industry News | 2017-08-30 16:58:11.0

Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.

Akrometrix

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