Industry News: coplanarity with lead (Page 1 of 111)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Altus Updates its Portfolio with GPD Global's Latest System

Industry News | 2016-11-21 16:42:03.0

Altus Group is now offering its customers in the UK and Ireland GPD Global's automated dispense systems which in response to customer demand, now have an integrated Pick & Place capability.

GPD Global

Richardson Electronics Expands Their Alliance with HUBER+SUHNER

Industry News | 2003-06-12 08:48:13.0

Richardson Electronics named first worldwide distributor

SMTnet

M~Wave in 3-year PCB Deal with CE Electronics

Industry News | 2003-02-19 09:12:55.0

M~Wave Said It Expects to Ship Approximately $750,000-$1 million of PCBs to CEE Over the Term of the Agreement

SMTnet

Shipley Company Announces Distribution Agreement with Unichem Industries

Industry News | 2003-04-18 08:31:57.0

Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.

SMTnet

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

SMTnet

DDI Corp. Provides Update on Negotiations with it's Senior Lenders and Convertible Noteholders

Industry News | 2003-04-04 08:46:37.0

Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002

SMTnet

PCB Technology Challenges Discussed at SMTA International

Industry News | 2011-10-03 15:37:21.0

The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International

Surface Mount Technology Association (SMTA)

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

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