Industry News: copper and flex and circuits (Page 8 of 11)

New PDR Hot Plate Attachments for LED Rework, Flex Circuit Rework and Aluminum Clad Circuit Card Assemblies

Industry News | 2017-06-07 12:04:53.0

PDR is pleased to introduce its new aluminum clad PCB rework tools for LED rework, flex circuit rework and aluminum clad circuit card assemblies. Designed to be incorporated into PDR’s existing line-up of Focused IR Rework Machines, PDR’s new Hot Plate series incorporates all of the best attributes of PDR technology into a contact heating system, thereby efficiently providing the thermal energy necessary to tackle the widest range of applications possible.

PDR-America

Super PCB to Display PCB Samples for LED RF, HDI and Other Applications at the SMTA West Penn Expo

Industry News | 2019-03-13 10:28:22.0

Super PCB will exhibit at the SMTA West Penn Expo & Tech Forum, scheduled to take place Tuesday, April 2, 2019 at the DoubleTree in Monroeville, PA. Company representatives will display samples of a number of current products in the fast-moving PCB industry, including single layer, two-layer, multilayer rigid PCBs, flex PCBs, rigid flex PCBs, aluminum PCBs for LED and Rogers PCBs for RF applications, HDI and others.

Super PCB

Engineered Material Systems Introduces Low-Cost Jettable Conductive Adhesive for Photovoltaic Stringing and Bussing Applications

Industry News | 2013-06-24 10:34:13.0

Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.

Engineered Materials Systems, Inc.

New High Thermal Conductivity LED Die Attach Adhesive for Small Die and LEDs from Engineered Material Systems

Industry News | 2013-09-05 20:26:22.0

Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.

Ventec to highlight advanced materials and service innovation at Productronica 2023

Industry News | 2023-10-30 19:24:35.0

Ventec International Group Co., Ltd. (6672 TT) will once again team up with partner Taiyo to promote the synergy between Ventec's substrate materials and Taiyo solder masks, at Productronica 2023, Munich November, 14-17 in Hall B3, Booth 242.

Ventec International Group

BTU International Hires Representation for New York, New Jersey and Eastern Pennsylvania

Industry News | 2019-03-21 14:01:56.0

BTU International is pleased to announce that it has hired JT Technologies as its newest manufacturers’ representative. John and Tom Kintner will represent BTU’s PYRAMAX reflow ovens in the states of New York, New Jersey and Eastern Pennsylvania.

BTU International

Toddco General, Inc. TG-1000 Hot Bar Bonding System for large displays and substrates

Industry News | 2014-08-16 17:55:06.0

Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.

Toddco3

Schlumberger Launches IC Modification Tool to Cut Costs and Cycle Times

Industry News | 2002-04-03 08:20:04.0

New Focused Ion Beam (FIB) IC Modification Tool

Schlumberger RMS

Barry Industries Introduces 800W Termination with 1.12:1 VSWR for Basestation, Broadcast and Radar Applications

Industry News | 2013-12-10 12:51:58.0

Barry Industries introduces a RoHS compliant flange mount termination which dissipates 800W with minimal return loss over a DC to 1GHz bandwidth.

Barry Industries, Inc.


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