Industry News: copper area (Page 11 of 14)

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio

Industry News | 2009-11-19 14:48:22.0

Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.

Henkel Electronic Materials

Nitrogen Protection Reflow Oven

Industry News | 2018-10-18 08:55:30.0

Nitrogen Protection Reflow Oven

Flason Electronic Co.,limited

Five Pros of Refrigeration Compressor of Mitsubishi Electric

Industry News | 2021-12-23 20:23:39.0

For refrigeration products, high efficiency and energy saving are the constant pursuit and breakthrough of technology. In cooling industry, Mitsubishi Electric has been occupying a significant place. With article, we are going to talk about five advantages of refrigeration compressor of Mitsubishi Electric to allow everyone to understand the technologies of Mitsubishi, and how they have made Mitsubishi a big shot in HVAC industry worldwide.

OKmarts Industrial Parts Mall

Advance in Semiconductor Technology Points the Way to Higher Functionality, Lower-Cost Electronic Products

Industry News | 2001-12-03 07:45:41.0

Motorola to Preview Next-Generation 0.10 micron CMOS Technology and New Gate Dielectric Material at World's Leading Semiconductor Device Conference

Motorola Mobility LLC.

NEW RF CENTER PROBE TEST SOCKET FOR DEVICES

Industry News | 2004-09-29 21:38:11.0

Frenchtown, NJ, September 2004

Aries Electronics Inc

Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

Industry News | 2009-04-09 22:35:29.0

The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.

Henkel Electronic Materials

Multicore LF700 Solder Paste from Henkel Offers Exceptional Lead-free, Halide-free Performance

Industry News | 2009-06-02 14:13:36.0

With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.

Henkel Electronic Materials

Nihon Superior’s SN100C University Research Recognized

Industry News | 2009-09-17 15:00:44.0

OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that research sponsored by the company was recognized by the University of Queensland as one of the best examples of a successful cooperation between the university and the industry.

Nihon Superior Co., Ltd.

Henkel to Show Latest Materials Innovations at APEX 2010

Industry News | 2010-03-17 18:53:38.0

Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment – even throughout the recent downturn – has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources that are unmatched.

Henkel Electronic Materials


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