Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2009-10-17 09:43:47.0
Reduce PCB Repair Costs
Industry News | 2019-11-05 22:22:32.0
1. The definition of Sideplating Sideplating is actually the metalization of the board edge in PCB filed. Edge plating、Border plated、plated contour、side metal, these words can be used too to describe same function. 2. Sideplating Process Drilling - Milling plated Slots - Cleaning - Copper sink 3. Pictures to show the finished board’s sideplating
Industry News | 2011-03-01 16:38:55.0
Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.
Industry News | 2023-09-04 13:25:54.0
Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project "KuSIn - Copper sinter processes using induction heating for electromobility applications", funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK).
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2022-05-18 13:01:33.0
Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
