Industry News | 2012-08-20 13:13:54.0
SEHO North America, Inc. and Balver Zinn announce a Selective Soldering Seminar from the SEHO Academy, scheduled to take place Tuesday, September 25, 2012
Industry News | 2008-04-09 00:04:58.0
OSAKA, JAPAN � April 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded 2 2008 SMT China Vision Award with Balver Zinn in the category of Soldering Materials for its innovative SN100C Paste.
Industry News | 2023-09-11 17:31:10.0
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2016-07-21 19:26:05.0
Conecsus announces the appointment of Gardner & Meredith, Inc., Manufacturer's Agents to represent Conecsus services and programs in the U.S. Southeast.
Industry News | 2019-10-26 15:12:49.0
Nathan Trotter announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Bar & Wire for its NT100Ge. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2023-05-03 09:01:22.0
Tresky GmbH from Hennigsdorf near Berlin will present its newly developed pre-sintering processes at this year's pcim EUROPE in Nuremberg. As assemblies with high-performance semiconductors represent a key technology for the global energy turnaround and electromobility, Tresky has been working on these manufacturing processes for some time and will present further product and process innovations in 2023 as part of additional development steps.
Industry News | 2012-07-19 13:34:37.0
The Balver Zinn Group announces that Cobar Solder Products Inc. now carries the Balver Zinn Braid, a desoldering braid with a no-clean flux formulation
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