Industry News: copper leached from solder (Page 8 of 35)

Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders

Industry News | 2011-12-30 23:26:12.0

Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.

Nihon Superior Co., Ltd.

Nihon Superior’s Keith Sweatman to Present at TMS 2011

Industry News | 2011-03-01 16:38:55.0

Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.

Nihon Superior Co., Ltd.

Nihon Superior Debuts New Lead-Free Presentation

Industry News | 2009-07-28 11:43:13.0

OSAKA, JAPAN — July 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that a new presentation about the challenges and issues in lead-free soldering is now available on the company’s Web site.

Nihon Superior Co., Ltd.

Conecsus Promotes Laurie Debord to Contract Administrations Manager

Industry News | 2016-04-04 11:45:09.0

Conecsus announces the appointment of 15-year veteran Laurie Debord to the position of Contract Administrations Manager. Conecsus, LLC processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market.

Conecsus LLC

Nihon Superior’s President Tetsuro Nishimura to Present at SMTA Pan Pacific Microelectronics Symposium 2012

Industry News | 2012-01-13 12:58:39.0

Nihon Superior announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii.

Nihon Superior Co., Ltd.

Conecsus Launches New Web Site; a ‘Green’ Knowledge Resource for Metals Recycling

Industry News | 2016-12-05 19:25:01.0

Conecsus, LLC, an innovative environmental technology and recycling company, announces the launch of its new web site at www.conecsusllc.com, a comprehensive resource for SMT electronics manufacturers and a wide range of other manufacturing industries that produce tin and other metals wastes. Conecsusllc.com provides a fresh look at the simplicity, and profitability, of trading metals waste for cash using Conecsus’ recycling programs. Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as Tin, Lead, Silver, Gold, and Copper from a variety of manufacturing industries. Conecsus converts these wastes into usable metal products. Conecsus’ raw materials come from a variety of manufacturing industries in North America and Europe, and our products are shipped worldwide.

Conecsus LLC

Nihon Superior to Exhibit at IPCA INTERNATIONAL EXPO 2012

Industry News | 2012-07-10 11:27:53.0

Nihon Superior (Singapore) Pte. Ltd.,announces that it will showcase a new, expanded range of products in booth G2 at the upcoming IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.

Nihon Superior Co., Ltd.

Balver Zinn Acquires Global License for Nihon Superior Co. Ltd.�s SN100C Solder Paste and Wire

Industry News | 2007-12-05 23:40:50.0

BALVE, GERMANY � December 4, 2007 � The Balver Zinn Group, a leading provider of high-quality anodes with various alloys as well as soft solders and special wires, announces that it is positioning itself to develop the opportunities presented by the global license it has acquired for solder pastes and wire using the proven SN100C alloy developed by Nihon Superior Co. Ltd.

Balver Zinn

Indium Corporation Sintering Expert to Present at EPTC

Industry News | 2023-12-11 12:32:10.0

Indium Corporation R&D Sintering Project Manager Demi Yao will deliver a presentation on pressure-less copper sintering paste for die-attach applications at the Electronics Packaging Technology Conference (EPTC) on December 8 in Singapore.

Indium Corporation

Nihon Superior to Present at the TMS 2008 Annual Meeting and Exposition

Industry News | 2008-03-05 22:38:31.0

OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.

Nihon Superior Co., Ltd.


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