Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2017-04-04 15:22:45.0
SMART Group announces that the “Printed Circuit Solderable Finish Defect Guide” has been printed and is available free of charge.
Industry News | 2016-04-18 11:30:07.0
Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.
Industry News | 2012-04-13 19:02:54.0
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars
Industry News | 2012-11-02 19:39:20.0
Engineered Conductive Materials, announces that Rich Wells will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming MWT Workshop, scheduled to take place November 20-21, 2012 at the Nemo Center in Amsterdam, The Netherlands.
Industry News | 2012-11-27 15:42:35.0
Engineered Conductive Materials, LLC,, will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming China Solar Grade Silicon and PV Power Conference (CSPV), scheduled to take place December 6-8, 2012 at the Shanghai Nan Jiao Hotel in Shanghai, China.
Industry News | 2009-04-09 22:35:29.0
The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
