Industry News: copper to edge (Page 1 of 88)

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Industry News | 2015-11-12 22:03:28.0

Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Inc.

GPS Antenna Shrinks to Surface Mounting

Industry News | 2003-03-14 09:03:48.0

Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.

SMTnet

Gould to Consolidate U.S. Copper Foil Manufacturing

Industry News | 2003-02-21 08:53:41.0

Gould Electronics Inc. said that all of its U.S. copper foil manufacturing will be consolidated at the company's Chandler, AZ facility by the end of the third quarter of 2003.

SMTnet

Nippon Mining Holdings to Increase Production Capacity for Rolled Copper Foil

Industry News | 2003-03-12 09:03:48.0

Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices

SMTnet

Blackfox Training Institute and ProSkill CTG form a Strategic Partnership to offer a Certification Course for the detection and prevention of counterfeit components.

Industry News | 2012-12-12 20:41:40.0

The Partnership was formed to provide awareness and training in the techniques and practices required to detect and avoid counterfeit components and the costs, legal issues and risks associated with them in order to prevent infestation of counterfeit material into the supply chain. There is an increasing volume of counterfeit electronic parts entering the aerospace supply chain and others, posing significant performance, reliability and safety risks.

Blackfox Training Institute, LLC

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

PCB Outline Layer And Keep-out Polygon Clearance

Industry News | 2018-10-18 11:13:35.0

PCB Outline Layer And Keep-out Polygon Clearance

Flason Electronic Co.,limited

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Industry News | 2017-08-06 19:39:48.0

The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

6 Things to Check Before Submitting Your PCB Design for Manufacturing

Industry News | 2018-10-18 11:23:54.0

6 Things to Check Before Submitting Your PCB Design for Manufacturing

Flason Electronic Co.,limited

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