Industry News | 2013-03-06 10:36:50.0
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-05-06 18:13:00.0
Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2014-01-24 16:21:17.0
Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.
Industry News | 2022-04-28 15:05:22.0
In times of climate change and increases in energy use, the demands of power modules for the efficient and reliable control of electric motors continue to rise. Modern module concepts are reaching their limits in terms of power density, current carrying capacity, and reliability to increase lifetime and reduce costs. A critical area for improving power modules is the material system used in them, as well as their electrical and thermal interconnection.
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
Industry News | 2011-05-12 22:07:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) launched its new Diamond FP and Ruby high-resolution X-ray inspection systems earlier today at Nepcon Shanghai.
Industry News | 2021-03-10 09:16:05.0
KDPOF Provides Efficient Optical Technology for Safe Backbone and ADAS Sensor Links in Vehicles
Industry News | 2011-09-26 16:59:34.0
Nordson DAGE announces that Dr. David Bernard, Product Manager – X-ray Systems, will present a paper titled “The Implications of Recent Technology Advances for X-Ray Inspection in Electronics” at the upcoming SMTA International Conference & Exhibition.
