Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2001-12-17 07:49:03.0
The following IPC products have now been released.
Industry News | 2010-04-16 11:20:45.0
IPC has released updates to key standards that affect your business. New versions of printed board standards IPC-A-600 and IPC-6012 have been released, along with key assembly standards IPC-A-610 and J-STD-001. If you become a member now, you will be eligible to get free copies of all of these standards, saving up to $393. And, of course, as more new standards are published, you can request a copy within 90 days, adding to your savings!
Industry News | 2012-07-12 16:39:49.0
— IPC — Association Connecting Electronics Industries® has released IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials.
Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Industry News | 2011-06-16 13:19:38.0
Counterfeit products are reported to have grown to a $600 billion business worldwide. The electronics assembly industry has been impacted, with reports of counterfeit feeders, spare parts and software causing equipment breakdowns and production delays. To assist IPC member companies in keeping their equipment and lines running, the Surface Mount Equipment Manufacturers Association (SMEMA) Council of IPC – Association Connecting Electronics Industries® is creating an “anti-counterfeit tool kit.”
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2003-05-08 07:04:57.0
Provides Industry with Strategic Assistance for the Future
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2001-11-09 07:41:57.0
IPC testified before a U.S. House of Representatives Committee on Small Business, Subcommittee on Regulatory Reform and Oversight hearing on the impact the Environmental Protection Agency's (EPA's) proposed metal products and machinery (MP&M) effluent limitations will have on the printed wiring board (PWB) industry.
