Industry News: corner bonding (Page 2 of 2)

MacDermid Alpha Presents Technical Paper at SMTA Penang Chapter

Industry News | 2022-09-15 06:27:38.0

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.

MacDermid Alpha Electronics Solutions

Keith Bryant to Present on Behalf of YXLON International at productronica

Industry News | 2017-10-18 20:31:57.0

YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.

YXLON International

Indium Corporation Experts to Present at EPTC

Industry News | 2021-11-22 06:40:32.0

Three Indium Corporation experts will present on the evolution of high-temperature lead-free solders, thermal management challenges for advanced packaging, and give a sponsored presentation on the company's high-performance, high-reliability materials during the virtual Electronics Packaging Technology Conference (EPTC), Dec. 1-3.

Indium Corporation

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