Industry News | 2012-01-24 20:21:12.0
Count On Tools introduces the new ezLOAD PCB support system. With the recent increase of densely populated double-sided circuit boards, COT recognized the need for more affordable board support options in the electronics manufacturing industry. The end result is an innovative design that is not only easy to setup and install, but also offers industry-leading benefits to EMS companies and contract manufacturers worldwide.
Industry News | 2004-02-04 16:11:55.0
Dynatech Technology has enhanced its 24/7 service line with a 30-minute call-back commitment for the manufacturer's chip mounters. The new service covers models CP 20 through CP60L. The new service is available through the company's business telephone line, 215-675-3566.
Industry News | 2004-05-21 18:35:48.0
Dynatech Technology has named Jonny Nichols as Eastern Regional Sales Manager, solidifying its organization since becoming the exclusive North American distributor for Samsung Techwin SMT equipment. Nichols will be responsible for managing Dynatech's rep network from Canada through Puerto Rico and extending as far west as Illinois and Mississippi.
Industry News | 2004-02-04 15:43:08.0
Citing its successful customer service relationship between the two companies, Samsung Techwin, formerly Samsung Aerospace, has given Dynatech International exclusive North American sales and service responsibilities for Samsung Techwin's SMT pick-and-place equipment. Dynatech International formed Dynatech Technology Corp. to handle the role. The companies developed their relationship in Dynatech's servicing of Samsung Techwin's mission-critical customers in the aerospace industries.
Industry News | 2003-11-21 17:22:35.0
Samsung Quality - Dynatech Service
Industry News | 2012-12-03 16:09:15.0
LPKF Laser & Electronics will present the webinar Stencil Aperture Size and Its Impact on the Printing Process Thursday, December 6, 2012 at 11 a.m. PST. The webinar examines the relationship between stencil aperture size and solder paste volume and how the stencil manufacturing process can influence both.
Industry News | 2017-12-03 18:33:48.0
Engineered Material Systems is pleased to debut its CA-183 low temperature cure electrically conductive adhesive. The low cost, flexible adhesive is designed for die attach and general circuit assembly applications.
Industry News | 2019-01-15 19:43:33.0
Engineered Material Systems is pleased to debut its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
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