Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2016-01-11 09:28:35.0
Saki also demonstrates 3D automated X-ray inspection and measurement systems.
Industry News | 2020-10-14 12:29:06.0
The DSG3000B RF Signal Generator series simplifies high power setup since an external amplifier is not needed. Engineers can generate more complex signals without additional hardware using the modulation schemes supplied in the DSG3000B with both internal and external IQ modulation capabilities.
Industry News | 2009-11-24 22:07:52.0
Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.
Industry News | 2015-01-19 21:35:01.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will highlight the Bi Rework Solder Paste (de-soldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The de-soldering paste has been designed for de-soldering Pb-free components and is ideal for LED removal.
Industry News | 2020-12-10 14:12:04.0
High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability
