Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Industry News | 2011-05-06 22:30:34.0
Nordson ASYMTEK introduces its new film coater for automated, selective, and precision application of conformal coating materials. The Nordson ASYMTEK Select Coat® SC-280 provides greater than 99 percent fluid transfer efficiency, improving material utilization by 30 to 50 percent.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2010-02-17 21:16:19.0
SOMERSET, NJ ? Permabond 820 quick-setting, instant adhesive resists temperature ranges up to 200ºC (390ºF). Typical ethyl cyanoacrylates only resist temperatures to 82ºC (180ºF). Permabond 820 is a modified ethyl cyanoacrylate that has a fast fixture time and high-temperature resistance, making it an ideal choice when bonding components in position on dual-sided PCBs prior to wave soldering. Permabond 820 is colorless with a viscosity of 100cPs.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2017-01-24 13:50:40.0
The ProFlow 2K is a dual component dispenser designed for applying small volumes of 2-part adhesives in lines or dots with a high level of control.
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2012-09-20 13:26:42.0
Electronics assemblers who need to produce prototypes, pre-production boards and other small batch/short-run jobs in-house can now get inline reflow results in a small footprint, at an affordable price-now with full computer control.
