Industry News: crack ic body (Page 4 of 6)

Seika Machinery to demo leading equipment from McDry, Sawa, Sayaka MALCOM and more at APEX

Industry News | 2022-01-03 07:22:33.0

Seika Machinery, Inc. is pleased to announce plans to exhibit at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. Seika will highlight the following equipment in Booth #1914: McDry Storage Cabinets, Sawa Ecobrid Stencil Cleaner, Sayaka SAM-CT23S Table-Top PCB Router, Tsuchiyama n=1 Checker and MALCOM RCX Series Modular Reflow Oven Profiling System.

Seika Machinery, Inc.

Two Chances to Meet with Seika Machinery at the SMTA Dallas & Houston Expos

Industry News | 2022-03-17 07:36:55.0

Seika Machinery, Inc. will exhibit at both the SMTA Dallas and Houston Expos. The SMTA Dallas Expo is scheduled to take place Tuesday, March 22, 2022 at the Plano Event Center. The SMTA Houston Expo will take place Thursday, March 24, 2022 at the Stafford Centre. Michelle Ogihara, Senior Sales and Marketing Manager, will discuss Seika's complete line, including: McDry Storage Cabinets, Sawa Ecobrid Stencil Cleaner, Sayaka SAM-CT23S Table-Top PCB Router, Tsuchiyama n=1 Checker and MALCOM RCX Series Modular Reflow Oven Profiling System.

Seika Machinery, Inc.

Meet with Seika Machinery in Booth 1012 at SMTAI for Viscometers, Stencil Cleaning, Dry Cabinets & More

Industry News | 2022-10-06 17:57:45.0

Seika Machinery, Inc. is pleased to announce plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. Seika will highlight the following equipment in Booth #1012: Malcom PCU-285 Viscometer, McDry Storage Cabinets, Sayaka CT23NJ PCB Router, Malcom RCX Series Modular Reflow Oven Profiling System and Unitech UC-250M-CV PCB Cleaner.

Seika Machinery, Inc.

Seika Machinery Offers Year-End Sale on McDry, Sawa, Sayaka & Malcom Products

Industry News | 2022-10-28 05:51:41.0

Seika Machinery, Inc. is pleased to announce its year-end sale on select products. Significant savings are available for McDry cabinets, Sawa ultrasonic stencil cleaners, Sayaka PCB routers and Malcom process control equipment while stock lasts.

Seika Machinery, Inc.

Nordson YESTECH Installs Advanced 3D AOI at the World’s Leading Supplier of Probe Cards

Industry News | 2017-04-25 21:49:48.0

Nordson YESTECH recently installed a FX-940 ULTRA 3D AOI system at FormFactor, Inc. (NASDAQ:FORM) in Carlsbad. The world’s leading supplier of probe cards to manufacturers of DRAM, Flash and SoCs (System-on-Chip), FormFactor has a global network of 16 facilities and employs more than 1500 people. The company will utilize Nordson’s FX-940 ULTRA 3D AOI system for automated inspection of its complex probe card assemblies.

Nordson YESTECH

Time Temperature setting wave soldering is the most important in the solder melts

Industry News | 2018-10-18 09:27:40.0

Time Temperature setting wave soldering is the most important in the solder melts

Flason Electronic Co.,limited

Koh Young will be Showcasing its Award-winning Inspection Solutions at electronica on 15-17 November 2022 in Munich, Germany

Industry News | 2022-10-19 13:14:00.0

Alzenau, Germany – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase its award-winning inspection solutions at electronica on 15-17 November 2022 in Munich, Germany. We will present our innovative technologies to a global audience at this leading tradeshow in booth A3.358.

Koh Young America, Inc.

KIC to Showcase the ProBot at the IPC APEX EXPO KIC’s ProBot Automatic Profiling System complements AOI and X-ray Inspection

Industry News | 2014-02-17 20:20:58.0

IC today announced that it will showcase the affordable and easy-to-use ProBot automatic profiling system in Booth #1336 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

KIC Thermal

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America


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