Industry News: crack package (Page 1 of 7)

SMTA China Presents Awards at SMTA China East 2010 Conference/Nepcon China 2010

Industry News | 2010-04-30 18:47:15.0

SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

Typical RoHS Issues in PCB Assembly

Industry News | 2018-10-18 10:23:07.0

Typical RoHS Issues in PCB Assembly

Flason Electronic Co.,limited

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Industry News | 2013-02-08 23:26:44.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.

Zymet, Inc

Koh Young Technology highlighted the versatile Meister system at Semicon Taiwan

Industry News | 2018-09-18 02:49:24.0

Seoul, South Korea – Koh Young Technology, the pioneer and leader in 3D inspection technology, showed the latest Meister-D for the SiP (System-in-Package) assembly process. This innovative technology was recently highlighted at SEMICON Taiwan in the Taipei Nangang Exhibition Center.

Koh Young America, Inc.

The System of X-ray Radiography Non-destructive Testing technology

Industry News | 2021-11-30 01:54:12.0

After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.

Unicomp Technology Co., Ltd

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