Industry News | 2017-01-05 04:27:37.0
BGA Inspection & Defect Photo Album (Can be downloaded) The photo CD-ROM album featuring over 280 colour images on BGA, materials, inspection and defects and is available to allow engineers to create their own training material, PowerPoint files, process documents, technical articles and standards. The disk includes examples of the following:
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2012-02-07 16:20:22.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
Industry News | 2018-04-05 17:27:40.0
SHENMAO America today announced plans to exhibit in Booth L1101 at AutoTronics Taipei 2018, scheduled to take place April 11-14 at the Nangang Exhibition Center. The company’s new PF610-P250 solder paste, PF606-F101 solder wire and SMCW-3 cleaner are designed for automotive applications.
Industry News | 2014-09-22 10:40:15.0
YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.
Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2021-04-21 10:17:09.0
Seoul, South Korea – At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2021-04-29 16:58:08.0
At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2013-12-12 17:23:04.0
The InspectoScan C automates the inspection of conformal coatings, through hole solder joints, edge connectors, mechanical parts, wiring, glue, and many other types of component.
Industry News | 2012-09-17 15:38:30.0
SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …
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