Industry News | 2020-05-25 13:28:07.0
SHENMAO America, Inc. is pleased to introduce its new PF606-F13 lead-free and halogen-free solder wire designed for automatic soldering equipment. The new solder wire enhances high-precision soldering, soldering efficiency and offers stable soldering quality.
Industry News | 2009-03-05 15:03:01.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 0402 metric chip components.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2006-04-17 11:14:44.0
Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia
Industry News | 2018-01-24 20:47:58.0
SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.
Industry News | 2022-01-05 09:15:19.0
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 25-27, 2022 in San Diego, California. After a lengthy lock-down, Koh Young will embrace the comprehensive safety and hygiene protocols in place to ensure a safe environment for attendees, so that the industry can meet face-to-face. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1717) and the Factory of the Future Pavilion (1701). The following is just a glimpse into what Koh Young will have in store for our visitors.
Industry News | 2022-12-21 10:42:04.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Industry News | 2018-05-16 19:57:33.0
SHENMAO America today announced plans to exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, MI. Company representatives will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens.
Industry News | 2015-05-24 10:37:43.0
Having produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow we believe we are in a good position to help engineers achieve better yields and implement high and low temperature processes with our next PIHR webinar http://www.bobwillisonline.com/training_detail.asp?WorkshopID=129
Industry News | 2014-10-01 19:42:59.0
Gen3 Systems Limited sponsors the IPC Europe High-Reliability Forum, scheduled to take place Oct. 14-15, 2014 in Düsseldorf, Germany.
