Industry News: crack solder joints top vs. bottom (Page 6 of 8)

Viscom to present new product developments at IPC APEX EXPO in San Diego

Industry News | 2017-01-29 09:07:54.0

At the upcoming IPC APEX EXPO, Viscom will present the latest generation of its inspection systems and solutions. The show is scheduled to take place Feb. 14–16, 2017 at the San Diego Convention Center, California, USA. Special highlights are the advanced 3D AOI with 360View, precise AOI for coating inspection, and the tried and tested X7056 3D AXI system. Last but not least: the new Viscom App for mobile devices will be presented.

Viscom AG

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Fast Double-Sided Inspection from Viscom at productronica 2023

Industry News | 2023-10-23 10:03:02.0

At productronica in Munich, Germany, taking place from November 14 to 17, 2023, Viscom AG will present for the first time its latest high-end iS6059 Double-Sided Inspection system. At Viscom's Booth A2.177, visitors to the world's leading trade fair for electronics manufacturing can learn more about the advantages of simultaneous optical assembly inspection from above and below using the new machine's special features.

Viscom AG

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

OK International to show Nepcon Shanghai 2009 visitors how to drive productivity in diverse applications

Industry News | 2009-04-10 00:26:25.0

OK International is preparing to take a wide range of innovative soldering and production assembly technologies to this year's Nepcon Shanghai being held over 21st � 24th April. On display at Booth 1D06, each system is designed to reduce training investment, perform a diverse array of applications and measurably increase productivity.

OK International

Flexible, High-Volume Selective Soldering from SEHO at APEX

Industry News | 2018-01-28 19:27:20.0

SEHO North America will highlight a full line of market leading soldering systems in Booth #3133 at the IPC APEX EXPO, scheduled to take place Feb. 27 – March 1, 2018 at the San Diego Convention Center.

SEHO Systems GmbH

DEN-ON INSTRUMENTS, CO., LTD. Will Exhibit the 7th Model Series RD-500SV Rework Station at productronica

Industry News | 2015-10-21 17:32:37.0

DEN-ON INSTRUMENTS is pleased to announce that it will exhibit with Technisches Büro Kullik GmbH (TBK) in Hall A4, Booth 231 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. TBK will showcase the 7th Model Series of DEN-ON INSTRUMENTS CO., LTD.’s RD-500SV Rework Station.

DEN-ON INSTRUMENTS CO., LTD.

Seika to Promote Its Latest Router and Probe Tester at SMTA Wisconsin

Industry News | 2013-09-13 07:05:50.0

Seika Machinery, Inc.announces that it will highlight the Sayaka SAM-CT23W and HIOKI 1240 at the SMTA Wisconsin/Great Lakes Expo & Tech Forum, scheduled to take place Wednesday, September 18, 2013 at the Crowne Plaza Milwaukee Airport in Wisconsin.

Seika Machinery, Inc.

Nordson DAGE Xi3400 Automated X-ray Inspection System to Make European Debut at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-09 11:23:43.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its market-leading portfolio of Test and Inspection equipment in Booth No. 7A-131 at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Nordson DAGE

MatriX- FocalSpot to Exhibit Advanced AXI Line Up at APEX

Industry News | 2014-02-20 12:25:26.0

MatriX-FocalSpotannounces that it will exhibit in Booth #348 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

MatriX Technologies GmbH


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