Industry News: cratering (Page 2 of 4)

IPC Honors Best Papers at IPC APEX EXPO� 2009

Industry News | 2009-04-15 23:01:13.0

BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Breaking Down Language Barriers: IPC-T-50J Now Available

Industry News | 2011-11-11 14:38:51.0

Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.

Association Connecting Electronics Industries (IPC)

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

Industry News | 2012-05-30 18:23:07.0

IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics

Association Connecting Electronics Industries (IPC)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

Electronics Industry Volunteers Honored for Contributions to Industry and IPC

Industry News | 2011-04-20 21:26:17.0

IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.

Association Connecting Electronics Industries (IPC)

VOLUNTEERS HONORED FOR CONTRIBUTIONS TO ELECTRONICS INDUSTRY AND IPC More than 150 awards presented at IPC APEX EXPO 2014

Industry News | 2014-03-28 09:54:48.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

Nordson DAGE Showcases 4000Plus Pad Cratering Inspection System at Nepcon Shanghai

Industry News | 2011-05-12 22:13:47.0

Nordson DAGE showcased its newly developed 4000Plus pad cratering inspection system at Nepcon Shanghai.

Nordson DAGE

Nordson DAGE's Senior Applications Engineer to Present at SMART Group BGA and Cleaning Reliability Conference

Industry News | 2011-10-03 17:04:22.0

Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.

Nordson DAGE

Nordson DAGE to Exhibit 4000Plus Multi-purpose Bondtester at NEPCON Vietnam 2011

Industry News | 2011-09-06 15:27:12.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) will highlight its 4000Plus multi-purpose bondtester in Booth F05 within the Singapore Pavillion at NEPCON Vietnam

Nordson DAGE


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