Industry News | 2021-09-02 05:46:58.0
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper "Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells" at the upcoming virtual European PV Solar Energy Conference and Exhibition which takes place from the 6th-10th September 2021.
Industry News | 2001-02-08 10:36:52.0
Royal Philips Electronics of the Netherlands, today announced the re-allocation of a number of businesses in the Specialty Products group of Consumer Electronics into other Philips entities. The re-allocation will better align the business' strategies with other parts of the Philips Group, and is intended to create synergies leading to improved efficiencies, and better market coverage.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2012-04-25 16:26:47.0
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announces that Dr. Frank Bottari and Dr. Tianming Bao presented technical papers at the China PV Technology International Conference (CPTIC)
Industry News | 2015-04-03 15:55:21.0
New High Density (HD) Instruments Increase Parallel Test Capability for Both Wafer and Final Test of Image Sensors
Industry News | 2022-05-12 10:35:23.0
The Versatile System-in-Packages Are Based on Renesas Microprocessors RZ/G2UL with CortexA55/CortexM33 and RZ/Five with RISC-V
Industry News | 2009-04-17 15:35:22.0
DEK is showing its next generation solar metallization line solutions at the SNEC PV Power Expo 2009 event in Pudong, Shanghai from the 6th to 8th May. The screen printing specialist is previewing details of its latest high-throughput PV3000 silicon cell metallization concept and running its state-of-the-art PV1200 metallization line live in Hall 6, Booth T621.
Industry News | 2014-07-23 13:15:08.0
ADLINK Technology today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.
Industry News | 2014-12-30 08:36:58.0
ADLINK Technology, Inc. today introduced a new SMARC® form factor computer-on-module running a Freescale i.MX6 processor based on the ARM Cortex-A9 architecture. With a choice of dual or quad-core processors running at from 800 MHz to 1.2 GHz with soldered memory up to 2GB DDR3L-1066/1333.The ADLINK LEC-iMX6 delivers top-of-the-line performance with efficient power consumption that targets a new generation of mobile applications requiring industrial-grade stability and reliability and supports an extremely wide operating temperature range of -40°C to +85°C thanks to ADLINK’s proven Extreme Rugged™ technology.
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