Industry News: cu osp widow time (Page 1 of 1)

New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

Industry News | 2018-06-03 19:11:33.0

SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.

Shenmao Technology Inc.

Practical Components and PACTECH Offer Flip Chip Test & Evaluation Kit and Board

Industry News | 2010-09-22 14:26:54.0

Practical Components Inc., a leading international national distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, announces a new PACTECH PCB310 Flip Chip Test & Evaluation Board for placement and daisy chain continuity testing after assembly.

Practical Components, Inc.

Practical Components Announces PCB200-Thermal Cycle Availability

Industry News | 2010-07-16 16:08:56.0

Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.

Practical Components, Inc.

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