Industry News: cyber se500 (Page 1 of 5)

SMTA China Announces 2012 Paper/Presentation Awards

Industry News | 2012-05-09 13:57:33.0

SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony,

Surface Mount Technology Association (SMTA)

CyberOptics to Officially Launch the SE500-D™ - SPI Dual-Lane System at NEPCON China 2011

Industry News | 2011-05-10 20:12:28.0

CyberOptics Corporation announces a new addition to its line of SPI solution, the Dual-Lane SE500-D™ system. The SE500-D™ will make its debut at NEPCON China 2011, making it the 5,501th system to be shipped from CyberOptics.

CyberOptics Corporation

CyberOptics SE500ULTRA™ SPI Awarded for Excellence in the Asian Electronics Industry

Industry News | 2012-04-26 21:04:05.0

CyberOptics Corporation (Nasdaq: CYBE) announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – SPI for its SE500ULTRA™

CyberOptics Corporation

Hyundai Mobis Invests in CyberOptics’ SE500™ SPI System

Industry News | 2010-11-15 22:18:42.0

CyberOptics announces that Hyundai Mobis has invested in the SE500™ 100 percent 3-D solder paste inspection system for its Tianjin plant. Hyundai Mobis' investment totals approximately US$500K.

CyberOptics Corporation

PRIDE Industries Places Order for CyberOptics’ Flagship 3-D SPI System – the SE500™

Industry News | 2012-06-27 14:07:07.0

PRIDE Industries, Inc has purchased two SE500™ 3-D Solder Paste Inspection (SPI) systems for its manufacturing facility in Roseville, CA.

PRIDE Industries, Inc.

CyberOptics to Premier SE500 � 3-D Solder Paste Inspection at APEX 2009

Industry News | 2009-03-10 18:41:17.0

MINNEAPOLIS - January 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce SE500, an advanced 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

CyberOptics Corporation

CyberOptics to Launch Its Newest SPI Dual Lane System and Showcase Its Fastest AOI System at NEPCON China 2011

Industry News | 2011-04-27 19:41:30.0

CyberOptics Corporation announces that it will introduce SE500-D™ Dual Lane SPI system with largest board handling capability and also exhibit its award-winning QX500™ AOI system at NEPCON China 2011.

CyberOptics Corporation

Viscom and CyberOptics Announce Cooperation Agreement for 3D Solder Paste Inspection Sensor Technology

Industry News | 2011-03-17 18:53:24.0

Viscom AG and CyberOptics jointly announce an OEM agreement to equip Viscom’s SPI inspection systems product line with CyberOptics’ 3D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms.

Viscom AG

CyberOptics Bags the Best Emerging Exhibit of the Year 2012 Award for its SE500ULTRA™ SPI System

Industry News | 2012-11-05 11:22:44.0

CyberOptics Corporation (Nasdaq: CYBE), announces that it has been awarded the Best Emerging Exhibit of the Year 2012 China East and China South by SMTA China for its all-new advanced SPI system – the SE500ULTRA™.

CyberOptics Corporation

CyberOptics Wins a 2009 Global Technology Award for its SE500 ™

Industry News | 2009-11-11 12:33:23.0

MINNEAPOLIS - November 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it has been awarded a Global Technology Award in the category of Best North American Product for its SE500 3-D Solder Paste Inspection system. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

CyberOptics Corporation

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