Industry News: cycle chamber (Page 5 of 7)

Jetting Into the Future: Techcon Brings Jet Tech Valve to APEX

Industry News | 2014-02-17 20:35:12.0

Techcon Systems will showcase the TS9200 Series Jet Tech valve in Booth #2225 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

Techcon Systems

Techcon Offers Solutions for the Complete Range of Dispensing Applications at NEPCON China

Industry News | 2014-04-15 07:48:16.0

Techcon Systems will exhibit in Booth #B-1E25 at NEPCON China 2014, scheduled to take place April 23-25, 2014 at the Shanghai World EXPO Exhibition & Convention Center.

Techcon Systems

Techcon Offers Solutions for the Complete Range of Dispensing Applications at NEPCON South China

Industry News | 2014-07-28 21:23:25.0

Techcon Systems, will exhibit in Booth #A-1K25 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center.

Techcon Systems

See Techcon’s Comprehensive Range of Dispensing Application Solutions at The ASSEMBLY Show 2014

Industry News | 2014-10-13 09:31:03.0

Techcon Systems announces that it will showcase its range of industry-leading dispensing solutions in Booth #344 at The ASSEMBLY Show from October 28-30, 2014 in Rosemont, IL.

Techcon Systems

Get the Spirit of Tomorrow: SEHO Will Introduce Zero-Fault Production at productronica

Industry News | 2015-10-21 15:16:40.0

SEHO Systems GmbH will highlight zero-fault production in hall A4, booth 578 at the upcoming productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Innovative solutions and custom-made automation technology demonstrate SEHO’s future viability.

SEHO Systems GmbH

Techcon Systems to Display Full Line of Valves at Productronica 2015

Industry News | 2015-10-21 19:35:48.0

Techcon Systems today announced they will exhibit a full line of valves and robots in Hall A4, Booth 221 at the upcoming Productronica International Trade Fair, scheduled to take place November 10-13, 2015 at the Messe in Munich, Germany.

Techcon Systems

Preview for Seica SMT Nuremberg April 26-28, 2016, booth # 7A.425

Industry News | 2016-04-04 11:35:00.0

The theme for Seica at SMT this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system, and the Firefly line, a premier laser selective soldering system.

SEICA SpA

Comet Group Receives 2017 Global Technology Award for Test Services at Lab One

Industry News | 2017-11-16 15:59:17.0

The Comet Group has been recognized with a 2017 Global Technology Award in the category of Test Services for its new Lab One technology and application center in Silicon Valley. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. In Lab One, customers find a “Think Tank” for brainstorming and idea creation. In addition to X-ray, they are offered easy access to plasma control and ebeam technologies as well as expert know-how.

YXLON International

Nordson MARCH Introduces the new-generation RollVIA plasma system for roll-to-roll production in PCB manufacturing operations Completely Self-Contained with Integrated Pump Package

Industry News | 2017-11-29 14:28:56.0

Nordson MARCH announces its new-generation RollVIA™ plasma system, a completely self-contained vacuum plasma system with production-proven, roll-to-roll material handling for flexible printed circuit board (PCB) manufacturing. The new RollVIA incorporates unique vacuum and gas flow technology, new process control technology, updated electrode designs, and superior temperature management with precise control of roll speed, tension, and edge guidance for uniform plasma treatment of substrates as thin as 25 microns. The RollVIA system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during production of PCBs.

MARCH Products | Nordson Electronics Solutions

Flexible, High-Volume Selective Soldering from SEHO at APEX

Industry News | 2018-01-28 19:27:20.0

SEHO North America will highlight a full line of market leading soldering systems in Booth #3133 at the IPC APEX EXPO, scheduled to take place Feb. 27 – March 1, 2018 at the San Diego Convention Center.

SEHO Systems GmbH


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