Industry News | 2021-09-02 06:10:22.0
MIRTEC announces the release of their comprehensive AI based Smart Factory Automation solution 'INTELLI-PRO'. This Technologically Advanced Software and Algorithm Package is specifically designed for the purpose of improving the performance and convenience of MIRTEC's complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2015-04-23 16:30:38.0
Metcal is pleased to announce that SMTA China awarded its Applications Manager, Paul Wood, ‘The Best Presentation of Vendor Conference One’ for the presentation titled “Why Non-Contact Array Solder Clean Up is required.” The award was presented during the SMTA China East 2015 Conference Award Presentation Ceremony on April 22, 2015 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2018-03-20 12:41:26.0
BEST Inc announces the availability of a custom ESD packaging service for electronic assemblies and components.
Circuit Technology Center, Inc.
Industry News | 2024-05-30 00:40:13.0
Despite the increasing popularity of lead-free PCBA, there are still advantages of leaded PCB assembly that make it irreplaceable.
Industry News | 2021-08-19 04:41:42.0
PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world's most trusted technology company for the semiconductor and electronic packaging industries, is pleased to announce that its 360-Degree Virtual Tour will be officially launched from 23 August 2021, in conjunction with SEMICON Southeast Asia 2021 which will be held virtually from 23 to 27 August 2021!
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
