Industry News | 2016-08-28 14:03:16.0
Gen3 Systems Limited has installed a second chamber due to the increase in demand for its Surface Insulation Resistance (SIR) and Conductive Anodic Filament Monitoring (CAF) test services. The new Temperature (& Humidity) Chamber (Platinous J Series) takes Gen3’s in-house testing facility to the next level.
Industry News | 2016-03-07 14:31:54.0
Four Vitronics Soltec XPM3 Reflow Soldering Systems were recently purchased and installed at Inovar, Inc., a full-service EMS provider. The reflow ovens currently are in use at Inovar on its three production lines as well as its prototype line.
Industry News | 2017-07-17 19:09:09.0
Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.
Industry News | 2022-10-06 18:14:49.0
PDR will exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The PDR team will showcase the IR-E6 XL Evolution Series and IR-E3 Series rework systems in Booth #1256.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2017-06-06 10:38:43.0
YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL. SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
Industry News | 2017-06-13 09:00:37.0
YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate.
Industry News | 2013-07-14 08:51:42.0
Microtronic GmbH announces the launch of its new product home page for the LBT-210 Solderability Tester.
Industry News | 2013-11-04 14:13:34.0
Microtronic GmbH announces that it will showcase its LBT-210 Solderability Tester in the LICO Stand #481, Hall A4 at the productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2020-10-22 03:17:25.0
4 Questions to help you better understand the High and Low Temperature Chamber
