Industry News | 2019-04-16 11:07:30.0
Innovative Solutions, test your IC Device with confidence without ever worrying about temperature requirements
Industry News | 2020-11-06 04:01:25.0
Temperature humidity test chambers replicate both the humidity and temperature of the environment. Humidity readings at intense temperatures signal to testers how they react to cold, hot, humid, and arid conditions in various mixes. Controlling humidity is hard without maintaining temperatures.
Industry News | 2015-02-02 18:32:12.0
Specialty Coating Systems (SCS) introduces the new Ionograph® SMD V and Ionograph® BT Series (bench top) contamination test systems. The redesigned SCS Ionograph SMD V is the latest in SCS’s line of ionic contamination test systems and the SCS Ionograph BT Series is a redesign of the current I500M Benchtop Ionographs.
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2008-03-25 22:45:17.0
Comment from Gary Stoffer, Vice President � Global Sales
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2008-05-30 10:22:55.0
OptoTherm offers environmental enclosure for EL system
Industry News | 2012-01-26 22:47:26.0
SEHO Systems GmbH announces that Christian Ott will present a paper titled “Reduction of Voids in Solder Joints: An Alternative to Vacuum Soldering” during the Voiding 1: Process and Test Technical Session on Tuesday, February 28, 2012 from 1:30-3 p.m. at the San Diego Convention Center in San Diego, CA. The paper, authored by Rolf Diehm, Mathias Nowottnick and Uwe Pape, will discuss voids in solder joins as one of the main problems for power electronics.
Industry News | 2017-01-15 19:48:37.0
PDR Americas today announced a new rework control package that reduces setup and changeover times effectively to zero and makes precision rework as simple as pushing a button. The ThermoActive+ Software will be demonstrated in Booth #2753 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.
Industry News | 2012-02-07 16:22:03.0
BTU International announced the receipt of multiple orders for PYRAMAX™ solder reflow ovens from semiconductor assembly and test subcontractors (SATS) located in Asia. The orders are valued in excess of $1 million and shipments will be completed during the first half of 2012.
