Industry News | 2011-03-31 11:05:40.0
Engineered Conductive Materials, LLC will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall A5, Stand 653 at the upcoming Intersolar Europe, scheduled to take place June 8-10, 2011 at the New Munich Trade Faire Centre in Munich, Germany.
Industry News | 2011-07-06 07:52:00.0
Engineered Conductive Materials introduces its DB-1538-2 Conductive Stringer Attach Adhesive, which is designed for use in thin-film, organic and thinned silicon solar modules.
Industry News | 2011-08-08 14:36:41.0
Engineered Conductive Materials, LLC will introduce its new line of conductive adhesives for back contact solar module applications in Hall A1, Stand B4 at the upcoming European Photovoltaic Solar Energy Conference and Exhibition (PVSEC), scheduled to take place September 5-8, 2011 at the CCH Congress Centre and International Fair in Hamburg, Germany.
Industry News | 2012-04-05 13:59:12.0
Engineered Conductive Materials introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV).
Industry News | 2012-04-13 19:02:54.0
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, debuts the fast curing conductive adhesive DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars
Industry News | 2012-06-12 08:47:07.0
Engineered Conductive Materials, LLC,will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Industry News | 2013-02-26 16:18:07.0
Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Industry News | 2013-04-25 16:35:51.0
Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.
Industry News | 2013-09-10 08:14:17.0
Engineered Material Systemswill introduce its DB-1588-3 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in Hall 2, stand E6 at the 28th European Photovoltaic Solar Energy Conference scheduled to take place October 1-3, 2013 at Parc des Expositions Paris Nord Villipinte in Paris, France.
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